Trenz Electronic FPGA Modules

The micromodules designed by Trenz Electronic feature modern Xilinx FPGA's.

With small size and high-density connectors, they can be used nearly everywhere.

Gigabit Ethernet and integrated USB 2.0 / 3.0 guarantees high data transfer rates to a host PC. A number of high-speed transceivers are also featured on the various modules.

Other assembly options for cost or performance optimization plus high volume prices available on request.

Modules
Photo
Form
factor
(cm)

TE0808 UltraSOM+

MPSoC module with Xilinx Zynq UltraScale+, 4 x 512 MByte (2 GByte) 64-Bit DDR4 memory, 2 x 256 MBit (2 x 32 MByte) SPI Boot Flash (dual parallel), B2B connectors: 4 x 160 pin, serial transceiver: GTR 4 (all) + GTH 16 (all), industrial temperature range, carrier board and starter kit available

5.2 x 7.6

TE0803

MPSoC module with Xilinx Zynq UltraScale+, 4 x 512 MByte (2 GByte) 64-Bit DDR4 SDRAM (up to 8 GByte max), 2 x 256 MBit (2 x 32 MByte) SPI Boot Flash dual parallel (up to 512 MByte max), Plug-on module with 4 x 160 pin B2B connectors, carrier board and starter kit available

5.2 x 7.6

TE0820

MPSoC module with Xilinx Zynq UltraScale+, 1 GByte (2 x 512 MByte) DDR4 SDRAM with 32-Bit width, 2 x 32 MByte Flash memory, B2B connectors: 2 x 100 pin and 1 x 60 pin, carrier board available

4 x 5

TE0782

SoC module with Xilinx Zynq-7035, Zynq-7045 or Zynq-7100, 1 GByte DDR3, 32 MByte QSPI Flash, 4 GByte eMMC (optional up to 64 GByte), 2 x Gigabit Ethernet Tranceiver, RTC, optional 2 x 8 MByte HyperRAM (max. 2 x 32 MByte), 16 GTX high-performance Tranceiver Lanes, industrial temperature range

8.5 x 8.5

TE0745

SoC module with Xilinx Zynq-7030 or Zynq-7045, 1 GByte DDR3 SDRAM, 32 MByte SPI Flash, 1 GBit Ethernet, 8 x GTX (7030: 4 GT), RTC, industrial temperature range, carrier board available

5.2 x 7.6

TE0715

SoC module with Xilinx Zynq-7015 or Zynq-7030, 1 GByte DDR3, 32 MByte QSPI Flash, 1 GBit Ethernet, 4 GTP/GTX Tranceivers, Programmable Clock Generator: Transceiver Clock (default 125 MHz), industrial and commercial temperature range, carrier board available

4 x 5

TE0720

SoC module with Xilinx Zynq-7020, 256 MByte/512 MByte DDR3L/1 GByte DDR3 (depending on version), 32 MByte SPI Flash, 4 GByte e-NAND (up to 32 GByte), 152 FPGA I/O's available on B2B connectors, RTC, 3 User LED's, automotive, industrial and commercial temperature range, carrier board and starter kit available

4 x 5

TE0728

SoC module with Xilinx automotive Zynq-7020, 512 MByte DDR3, 16 MByte QSPI Flash, 2 x 100 MBit Ethernet Transceiver (PHY), 76 single ended I/O, 24 LVDS pairs (48 I/O) and 42 MIO available on B2B connectors, CAN Transceiver (PHY), automotive temperature range, carrier board available

6 x 6

TE0729

SoC module with Xilinx Zynq-7020, 512 MByte DDR3, 32 MByte QSPI-Flash, 1 x 10/100/1000 Mbps Ethernet transceiver PHY, 2 x 10/100 Mbps Ethernet transceiver PHYs, RTC, equipped with sulfur resistant resistors, industrial temperature range, carrier board available

5.2 x 7.6

TE0722 "DIPFORTy1 Soft Propeller"

Propeller compatible DIP40 pinout module with Xilinx Zynq-7010, 16 MByte SPI Flash (primary boot), 33.333 MHz Clock (MEMS Oscillator), Total user accessible PL I/O: 46 (+3 Input only), MicroSD Card socket, commercial temperature range

1.8 x 5.1

TE0723 "ArduZynq"

SoC module with Xilinx Zynq-7010 with Arduino Shield form factor, 128 MByte DDR3L; version M: 512 MByte DDR3L, 16 MByte SPI Flash, Hi-Speed USB2.0 ULPI Transceiver, 23 FPGA I/O's on B2B connectors available, commercial temperature range

Arduino shield

TE0726 "ZynqBerry"

SoC module with Xilinx Zynq-7010 with Raspberry Pi form factor, 512 MByte (128 MByte) DDR3L, 16 MByte SPI Flash, Micro SD socket, 4 USB with power switches, 100 MBit Ethernet, DSI and CSI-2 Connector (display and camera), HAT header with 26 I/O's, commercial temperature range

Raspberry Pi
Model 2

TE0841

FPGA module with Xilinx Kintex UltraScale, 2 banks with 512 MByte each, 16-bit wide DDR4, 32 MByte SPI Boot Flash, 3.2 mm mounting holes for skyline heat spreader, serial transceiver: GTH 8 Lanes (all), industrial and commercial temperature range, carrier board available

4 x 5

TE0741

FPGA module with Xilinx Kintex-7 70T, 160T, 325T or 410T, 32 MByte Quad-SPI Flash, max. GTX transceiver data rate 10,3125 Gb/s (default 6,6 Gb/s), 8 Multi Gigabit Transceivers, 2 User LED, 1 DONE PFGA pin LED, industrial and commercial temperature range, carrier board available

4 x 5

TE0710

FPGA module with Xilinx Artix-7 35T or 100T, 512 MByte DDR3, 32 MByte QSPI Flash, 2 x 100 MBit Ethernet, industrial and commercial temperature range, carrier board available

4 x 5

TE0711

FPGA module with Xilinx Artix-7 35T or 100T, 32 MByte QSPI Flash, 100 MHz MEMS oscillator, 178 FPGA I/O's (84 differential pairs), 3 User LED's, industrial and commercial temperature range, carrier board available

4 x 5

TE0712

FPGA module with Xilinx Artix-7 100T or 200T, 1 GByte DDDR3, 32 MByte Quad-SPI Flash, 100 MBit Ethernet, 4 Multi Gigabit transceivers, industrial and commercial temperature range, carrier board available

4 x 5

TE0713

FPGA module with Xilinx Zynq Artix-7,  USB 3.0 to FIFO bridge, 1 GByte of DDR3L SDRAM, 32 MByte Flash memory, Plug-on module with 2 x 100-pin and 1 x 60-pin high-speed hermaphroditic strips, carrier board avialable

4 x 5

TE0714

FPGA module with Xilinx Artix-7 35T or 50T, 16 MByte QSPI Flash, smallest module with tranceivers, industrial temperature range, carrier board available

4 x 3

TE0725

FPGA module with Xilinx Artix-7 15T, 35T or 100T, 32 MByte Flash, from revision 03 64 MBit HyperRAM, 2 x 50 Pin with 2.54 mm pitch, optional Fiber Optic Module (125/250 or 1000 MBit/s), commercial temperature range available (industrial temperature range on request)

7.3 x 3.5

TE0725LP

FPGA module with Xilinx Artix-7 100T, 32 MByte Flash, optional HyperRAM or HyperFlash, 2 x 50 pin with 2,54 mm pitch, VIN 3,3V or 1,8V, commercial temperature range available (industrial temperature range on request)

7.3 x 3.5

TE0600

GigaBee module with Xilinx Spartan-6 LX45, LX100 or LX150, two independent 128 MByte DDR SDRAM banks (optional 2 x 512 MByte DDR SDRAM), 16 MByte SPI Flash, 10/100/1000 tri-speed GBit Ethernet transceiver (PHY), JTAG Port, industrial and commercial temperature range, carrier board available

4 x 5

TE0630

FPGA module with Xilinx Spartan-6 LX45, LX75 oder LX150, 128 MByte DDR3, 8 MByte SPI Flash, up to 40 different and up to 109 single end FPGA I/O pins available on B2B connectors, 1.2 V, 1.5 V, 2.5 V = VCCAUX and 3.3 V power rails, 4 User LED, 1 User Push-Button, 2 User DIP Switches, industrial temperature range, carrier board available

4 x 5

TE0320

Module with Xilinx Spartan-3A, 1 GBit DDR RAM up to 1333 MByte/s bandwidth, 32 MBit SPI Flash, 109 I/Os (+ 10 dual-purpose pins) available on B2B connectors, 4 LED, 2 Push Buttons, 8 DIP Switches, industrial and commercial temperature range, carrier board available

6.8 x 4.8

TE0300

FPGA module with Xilinx Spartan-3E, 32 MBit SPI Flash, 512 MBit DDR RAM up to 666 MByte/s bandwidth, 3 on-board DC-DC converters for high efficieny, 104 I/Os + 6 Inputs available on B2B connectors, industrial and commercial temperature range, carrier board available

4.05 x 4.75

TE0140

Module with Xilinx Spartan-3, USB 2.0 transceiver, 16 KBit EEPROM, 120 available I/O's on B2B connectors, one LED, 1 push button, commercial temperature range, carrier board available

5.07 x 4.36

Availability and Ordering

  • Concurrent EDA is the US Distributor for Trenz Electronic FPGA Micromodules.
  • Please email Ray at This e-mail address is being protected from spambots. You need JavaScript enabled to view it for pricing and availability.

Spartan 6 FPGA Module

TE0600 Spartan-6 Module

This Xilinx Spartan 6 is ready for deployment.  This FPGA module contains:

  • Xilinx Spartan 6 LX45, LX100 or LX150 FPGA
  • 2 x 100-pin high-speed hermaphroditic strips
  • 128 Mbit (16 MByte) serial Flash memory with dual/quad SPI interface
  • 32-bit wide 8Gbit DDR3
  • Gitabit Ethernet
  • 150 FPGA I/O

Kintex Overview

Kintex®-7 FPGAs provide your designs with the best price/performance/watt at 28nm while giving you high DSP ratios, cost-effective packaging, and support for mainstream standards like PCIe® Gen3 and 10 Gigabit Ethernet. The Kintex-7 family is ideal for applications including 3G and 4G wireless, flat panel displays, and video over IP solutions.

All this on tiny footprints at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

All parts range from commercial through extended and industrial temperature ranges.

ModelFPGASPI FlashTemp.
Range
Max. GTX transceiver
data rate
TE0741-03-070-2CF XC7K070T-2FBG676C 32 MByte commercial 6.6 Gb/s
TE0741-03-070-2IF XC7K070T-2FBG676I 32 MByte industrial 6.6 Gb/s
TE0741-03-160-2CF XC7K160T-2FBG676C 32 MByte commercial 6.6 Gb/s
TE0741-03-160-2C1
XC7K160T-2FFG676C 32 MByte commercial 10.3125 Gb/s
TE0741-03-160-2IF XC7K160T-2FBG676I 32 MByte industrial 6.6 Gb/s
TE0741-03-325-2CF XC7K325T-2FBG676C 32 MByte commercial 6.6 Gb/s
TE0741-03-325-2IF XC7K325T-2FBG676I 32 MByte industrial 6.6 Gb/s
TE0741-03-410-2CF XC7K410T-2FBG676C 32 MByte commercial 6.6 Gb/s

TEF1001-01 XC7K160T-2FBG676I 32 MByte industrial 4x PCI Gen2 Lanes w/ HPC FMC

Zynq SoC Block Diagram

The Zynq®-7000 All Programmable SoC (AP SoC) family integrates the software programmability of an ARM®-based processor with the hardware programmability of an FPGA, enabling key analytics and hardware acceleration while integrating CPU, DSP, ASSP, and mixed signal functionality on a single device. Consisting of single-core Zynq-7000S and dual-core Zynq-7000 devices, the Zynq-7000 family is the best price to performance-per-watt, fully scalable SoC platform for your unique application requirements.

All this on tiny footprints at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

All parts range from commercial through extended and industrial temperature ranges.

ModelSize (cm)SoCRAMEthernetTemp.
Range
TE0715-04-15-1I 4 x 5 XC7Z015-1CLG485I 1 GByte DDR3L 1 GBit industrial
TE0715-04-15-2I 4 x 5 XC7Z015-2CLG485I 1 GByte DDR3L 1 GBit industrial
TE0715-04-30-1I 4 x 5 XC7Z030-1SBG485I 1 GByte DDR3L 1 GBit industrial
TE0715-04-30-3E 4 x 5 XC7Z030-3SBG485E 1 GByte DDR3L 1 GBit extended
TE0715-04-15-1I3 * 4 x 5 XC7Z015-1CLG485I 1 GByte DDR3L 1 GBit industrial
TE0715-04-30-1I3 * 4 x 5 XC7Z030-1SBG485I 1 GByte DDR3L 1 GBit industrial
TE0715-04-30-1C 4 x 5 XC7Z030-1SBG485C 1 GByte DDR3L 1 GBit commercial
TE0715-04-12S-1C 4 x 5 XC7Z012S-1CLG485C 1 GByte DDR3L 1 GBit commercial
TE0720-03-2IF 4 x 5 XC7Z020-2CLG484I 1 GByte DDR3 1 GBit industrial
TE0720-03-2IFC3 * 4 x 5 XC7Z020-2CLG484I 1 GByte DDR3 1 GBit industrial
TE0720-03-2IFC8 4 x 5 XC7Z020-2CLG484I 1 GByte DDR3 1 GBit industrial
TE0720-03-1CF 4 x 5 XC7Z020-1CLG484C 1 GByte DDR3 1 GBit commercial
TE0720-03-1CR 4 x 5 XC7Z020-1CLG484C 256 MByte DDR3 1 GBit commercial
TE0720-03-14S-1C 4 x 5 XC7Z014S-1CLG484C 1 GByte DDR3 1 GBit commercial
TE0720-03-1QF 4 x 5 XA7Z020-1CLG484Q 1 GByte DDR3 1 GBit automotive
TE0722-02I 1.8 x 5.1 XC7Z010-1CLG225I - - industrial
TE0722-02 1.8 x 5.1 XC7Z010-1CLG225C - - commercial
TE0722-02-07S-1C 1.8 x 5.1 XC7Z007S-1CLG225C 16 MByte - commercial
TE0723-02 Arduino Shield XC7Z010-1CLG225C 128 MByte DDR3L - commercial
TE0723-03M Arduino Shield XC7Z010-1CLG225C 512 MByte DDR3L - commercial
TE0723-03-07S-1C Arduino Shield XC7Z007S-1CLG225C 512 MByte DDR3L - commercial
TE0726-03M Raspberry Pi Model 2 XC7Z010-1CLG225C 512 MByte DDR3L 100 MBit commercial
TE0726-03R Raspberry Pi Model 2 XC7Z010-1CLG225C 128 MByte DDR3L - commercial
TE0726-03-07S-1C Raspberry Pi Model 2 XC7Z007S-1CLG225C 512 MByte DDR3L 100 MBit commercial
TE0728-03-1Q 6 x 6 XA7Z020-1CLG484Q 512 MByte DDR3 2 x 100 MBit automotive
TE0729-02-2IF 5 x 7 XC7Z020-2CLG484I 512 MByte DDR3 2 x 100 MBit, 1 x 1 GBit industrial
TE0745-02-30-1I 5.2 x 7.6 XC7Z030-1FBG676I 1 GByte DDR3 1 x GBit industrial
TE0745-02-30-2IA 5.2 x 7.6 XC7Z030-2FBG676I 1 GByte DDR3 1 x GBit industrial
TE0745-02-35-1C 5.2 x 7.6 XC7Z030-2FBG676I 1 GByte DDR3 1 x GBit industrial
TE0745-02-45-1C 5.2 x 7.6 XC7Z045-1FBG676C 1 GByte DDR3 1 x GBit commercial
TE0745-02-45-2I 5.2 x 7.6 XC7Z045-2FBG676I 1 GByte DDR3 1 x GBit industrial
TE0745-02-45-3EA 5.2 x 7.6 XC7Z045-2FBG676I 1 GByte DDR3 1 x GBit extended
TE0782-02-045-2I 8.5 x 8.5 XC7Z045-2FFG900I 1 GByte DDR3 2 x GBit industrial
TE0782-02-100-2I 8.5 x 8.5 XC7Z100-2FFG900I 1 GByte DDR3 2 x GBit industrial
TE0782-02-035-2I 8.5 x 8.5 XC7Z035-2FFG900I 1 GByte DDR3 2 x GBit industrial

* These modules are identically constructed to the TE0715-xx-1I and TE0720-xx-2IF respectively, except there are 2.5mm Samtec connectors installed instead of 4mm.

Zynq MPSoC EG Block Diagram

Zynq® UltraScale+™ MPSoC devices provide 64-bit processor scalability while combining real-time control with soft and hard engines for graphics, video, waveform, and packet processing. Built on a common real-time processor and programmable logic equipped platform, three distinct variants include dual application processor (CG) devices, quad application processor and GPU (EG) devices, and video codec (EV) devices, creating unlimited possibilities for applications such as 5G Wireless, next generation ADAS, and Industrial Internet-of-Things.

All this on tiny footprints (5.2 x 7.6 cm and 4 x 5 cm) at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

All parts range from extended temperature range to industrial temperature range.

Model Size (cm) FPGAPins RAM SPI Flash (GPU) (VCU) Temp.
range
TE0803-01-02CG-1EA 5.2 x 7.6 XCZU2CG-1SFVC784E 784 2 GByte DDR4 128 MByte - - extended
TE0803-01-03CG-1EA 5.2 x 7.6 XCZU3CG-1SFVC784E 784 2 GByte DDR4 128 MByte - - extended
TE0803-01-04CG-1EA 5.2 x 7.6 XCZU4CG-1SFVC784E 784 2 GByte DDR4 128 MByte - - extended
TE0803-01-02EG-1E 5.2 x 7.6 XCZU2EG-1SFVC784E 784 2 GByte DDR4 64 MByte x - extended
TE0803-01-03EG-1EA 5.2 x 7.6 XCZU3EG-1SFVC784E 784 2 GByte DDR4 128 MByte x - extended
TE0803-01-03EG-1EB 5.2 x 7.6 XCZU3EG-1SFVC784E 784 4 GByte DDR4 128 MByte x - extended
TE0803-01-04EG-1EA 5.2 x 7.6 XCZU4EG-1SFVC784E 784 2 GByte DDR4 128 MByte x - extended
TE0803-01-04EV-1EA 5.2 x 7.6 XCZU4EV-1SFVC784E 784 2 GByte DDR4 128 MByte x x extended
TE0803-01-05EV-1EA 5.2 x 7.6 XCZU5EV-1SFVC784E 784 2 GByte DDR4 128 MByte x x extended
TE0808-04-09EG-1EE 5.2 x 7.6 XCZU9EG-1FFVC900E 900 4 GByte DDR4 128 MByte x - extended
TE0808-04-09EG-1ED* 5.2 x 7.6 XCZU9EG-1FFVC900E 900 4 GByte DDR4 64 MByte x - extended
TE0808-04-09EG-1EL* 5.2 x 7.6 XCZU9EG-1FFVC900E 900 4 GByte DDR4 128 MByte x - extended
TE0808-04-09EG-2IE 5.2 x 7.6 XCZU9EG-2FFVC900I 900 4 GByte DDR4 128 MByte x - industrial
TE0808-04-15EG-1EB
5.2 x 7.6 XCZU15EG-1FFVC900E 900 4 GByte DDR4 64 MByte x - extended
TE0820-02-02CG-1EA 4 x 5 XCZU2CG-1SFVC784E 784 1 GByte DDR4 128 MByte - - extended
TE0820-02-03CG-1EA 4 x 5 XCZU3CG-1SFVC784E 784 1 GByte DDR4 128 MByte - - extended
TE0820-02-04CG-1EA 4 x 5 XCZU4CG-1SFVC784E 784 1 GByte DDR4 128 MByte - - extended
TE0820-02-02EG-1EA 4 x 5 XCZU2EG-1SFVC784E 784 1 GByte DDR4 128 MByte x - extended
TE0820-02-02EG-1EL* 4 x 5 XCZU2EG-1SFVC784E 784 1 GByte DDR4 128 MByte x - extended
TE0820-02-03EG-1EA 4 x 5 XCZU3EG-1SFVC784E 784 1 GByte DDR4 128 MByte x - extended
TE0820-02-03EG-1EL*
4 x 5 XCZU3EG-1SFVC784E 784 1 GByte DDR4 128 MByte x - extended
TE0820-02-04EV-1EA 4 x 5 XCZU4EV-1SFVC784E 784 1 GByte DDR4 128 MByte x x extended

* These modules are identically constructed to the TE0808-xx-09EG-1EB and TE0820-xx-xx-1Ex respectively, except there are 2.5 mm Samtec connectors installed instead of 4.0 mm.

Contact

Telephone
412.687.8800
Address
5001 Baum Blvd Ste 640
Pittsburgh PA 15213
Email
info@concurrenteda.com