TE0715 Series (Z-7015, Z-7030) Datasheet

Zynq Module TE0715 TE0715 Block Diagram

Overview

Trenz Electronic TE0715s are industrial-grade SoC modules integrating a Xilinx Zynq-7000 SoC, a gigabit Ethernet transceiver, 1 gigabyte DDR3 SDRAM with 32-bit width, 32 megabyte Flash memory for configuration and operation, 4 transceivers, a USB ULPI transceiver, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/Os is provided via rugged high-speed stacking strips. All modules in 4 x 5 cm form factor are mechanically compatible. All this on a tiny footprint, smaller than a credit card, at the most competitive price. A free and open embedded development suite with reference designs is included.

Key Features

  • Xilinx Zynq-7000 (Z-7015, Z-7030) SoM (system on module), supported by the free Xilinx Vivado WebPACK tool
  • Rugged for shock and high vibration
  • 2x ARM Cortex-A9
  • 10/100/1000 tri-speed gigabit Ethernet transceiver (PHY) with SGMII
    - MAC Address EEPROM
  • 32-Bit-wide 1 GByte DDR3 SDRAM
  • 32 MByte QSPI Flash memory (with XiP support)
  • Programmable Clock Generator
    - Transceiver Clock (default 125 MHz)
  • Plug-on module with 2× 100-pin and 1× 60-pin high-speed hermaphroditic strips
  • 132 FPGA I/Os (65 LVDS pairs possible) and 14 PS-MIO available on board-to-board connectors
  • 4 GTP/GTX (high-performance transceiver) lanes
    - GTP/GTX (high-performance transceiver) clock input
  • USB 2.0 high-speed ULPI transceiver
  • On-board high-efficiency DC-DC converters
    • 4.0 A x 1.0 V power rail
    • 1.5 A x 1.5 V power rail
    • 1.5 A x 1.8 V power rail
  • System management
  • eFUSE bit-stream encryption
  • AES bit-stream encryption
  • Temperature compensated RTC (real-time clock)
  • User LED
  • Evenly-spread supply pins for good signal integrity
  • Assembly options for cost or performance optimization available upon request.

Heatsink - Spring-Loaded

Heatsink for TE0715

Made especially for TE0715 board, spring-loaded, weight: 60g

Part No. 26923

Package Content

  • 1 Thermal Pad
  • 4 pressure springs
  • 2 spacers
  • 4 screws

Embedded Development Suite

A hardware development platform is available. Latest documentation, design support files, reference design source files and tools are available for download free of charge.

Available Models

Model FPGA DDR SDRAM Temperature Range Availability
TE0715-03-15-1I XC7Z015-1CLG485I 1 GByte
-40°C - 85°C special order
TE0715-03-15-2I XC7Z015-2CLG485I 1 GByte
-40°C - 85°C special order
TE0715-03-30-1C XC7Z030-1SBG485C 1 GByte
0 - 70°C special order
TE0715-03-30-1I XC7Z030-1SBG485I 1 GByte
-40°C - 85°C special order
TE0715-03-15-1I3 XC7Z015-1SBG485I
(low profile)
1 GByte
-40°C - 85°C special order
TE0715-03-30-1I3 XC7Z030-1SBG485I
(low profile)
1 GByte
-40°C - 85°C special order

Pricing, Availability and Ordering

  • Concurrent EDA is the US Distributor for Trenz Electronic FPGA Micromodules.
  • Currently Available to US customers only.
  • Please email Ray at This e-mail address is being protected from spambots. You need JavaScript enabled to view it with questions / pricing / orders.

Technical Documentation from Trenz Electronic

Contact

Telephone
412.687.8800
Address
5001 Baum Blvd Ste 640
Pittsburgh PA 15213
Email
info@concurrenteda.com