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TE0803 Zynq UltraScale+ Module Datasheet

TE0803 Zynq UltraScale+ Module TE0803 Zynq UltraScale+ Module (bottom)

Overview

The Trenz Electronic TE0803 is an industrial-grade MPSoC module integrating a Xilinx Zynq UltraScale+ with ZU2CG, 2 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

These high-density integrated modules are smaller than a credit card, and available in several variants at the most competitive price.

All parts are at least extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
  • ZU2CG, 784 Pin Packages
  • Dimensions: 5.2 x 7.6 cm
  • Plug-on module with 4 x 160 pin B2B connectors
  • 3 mm mounting holes for skyline heat spreader
  • Rugged for shock and high vibration.
  • 2 GByte 64-Bit width DDR4 SDRAM
  • 128 MByte QSPI Boot Flash dual parallel
  • User I/O
    • 65 x multi-use I/O's (MIO)
    • 156 high-performance (HP) I/O's (3 banks)
    • Serial transceiver: PS-GTR 4
    • Programmable 4-channel PLL clock generator
  • All power supplies on board, single 3.3V power source required
  • Evenly spread supply pins for good signal integrity.

Package Contents

  • 1 x Zynq UltraScale+ MPSoC module TE0803 with ZU2EG

Available Models

Model Size (cm) FPGA RAM SPI Flash (GPU) (VCU) Temp.
range
Availability
TE0803-01-02CG-1EA 5.2 x 7.6 XCZU2CG-1SFVC784E 2 GByte DDR4 128 MByte - - extended 1 - 2 weeks
TE0803-01-03CG-1EA 5.2 x 7.6 XCZU3CG-1SFVC784E 2 GByte DDR4 128 MByte - - extended 1 - 2 weeks
TE0803-01-04CG-1EA 5.2 x 7.6 XCZU4CG-1SFVC784E 2 GByte DDR4 128 MByte - - extended 1 - 2 weeks
TE0803-01-02EG-1E 5.2 x 7.6 XCZU2EG-1SFVC784E 2 GByte DDR4 64 MByte x - extended 1 - 2 weeks
TE0803-01-03EG-1EA 5.2 x 7.6 XCZU3EG-1SFVC784E 2 GByte DDR4 128 MByte x - extended 1 - 2 weeks
TE0803-01-03EG-1EB 5.2 x 7.6 XCZU3EG-1SFVC784E 4 GByte DDR4 128 MByte x - extended 1 - 2 weeks
TE0803-01-04EG-1EA 5.2 x 7.6 XCZU4EG-1SFVC784E 2 GByte DDR4 128 MByte x - extended 1 - 2 weeks
TE0803-01-04EV-1EA 5.2 x 7.6 XCZU4EV-1SFVC784E 2 GByte DDR4 128 MByte x x extended 1 - 2 weeks
TE0803-01-05EV-1EA 5.2 x 7.6 XCZU5EV-1SFVC784E 2 GByte DDR4 128 MByte x x extended 1 - 2 weeks

* These modules are identically constructed to the TE0820-xx-xx-1Ex except there are 2.5 mm Samtec connectors installed instead of 4.0 mm.

Embedded Development Suite

A hardware development platform is available. Latest documentation, design support files, reference design source files and tools are available for download free of charge.

* Device supported by the free Xilinx Vivado WebPACK tool.

Pricing, Availability and Ordering

  • Concurrent EDA is the US Distributor for Trenz Electronic FPGA Micromodules.
  • Currently Available to US customers only.
  • Please email Ray at This e-mail address is being protected from spambots. You need JavaScript enabled to view it with questions / quotes / orders.

Contact

Telephone
412.687.8800
Address
5001 Baum Blvd Ste 640
Pittsburgh PA 15213
Email
info@concurrenteda.com