TE0630 Spartan 6 Module (45/75/100/150) Series

Overview

Trenz Electronic TE0630 series are industrial-grade SoC micro-modules integrating a leading-edge Xilinx Spartan-6 FPGA, a mini-USB 2.0 device port, 1 GBit (128-MByte) DDR3 SDRAM with 16-Bit width, 8 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's are provided via rugged high-speed stacking connectors. TE0630 is fully mechanically and largely electrically backward compatible with Trenz Electronic TE0300 Xilinx Spartan-3E FPGA micro-modules.

All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

All this on a tiny footprint, smaller than a credit card, at the most competitive price.

Key Features

• Industrial-grade Xilinx Spartan-6 LX FPGA micro-module (45/75/100/150)
• mini-USB 2.0 high-speed device (for configuration and operation)
• 16-Bit-wide 1 GBit (128 MByte) DDR3 SDRAM
• 64 MBit (8 MByte) SPI Flash memory (for configuration and operation) accessible through:
  - FPGA
  - JTAG port (SPI indirect)
  - USB
• FPGA configuration through:
  - B2B connector
  - JTAG port
  - SPI Flash memory
• Plug-on module with 2 × 80-pin stacking connectors
• Up to 40 differential and up to 109 single-ended FPGA I/O pins available on B2B connectors
• 1.2 V, 1.5 V, 2.5 V = VCCAUX and 3.3 V power rails
• 24 MHz and 100 MHz reference clock signals
• eFUSE bit-stream encryption (LX75 or larger)
• 4 user LEDs
• 1 user push-button
• 2 user DIP switches
• Evenly-spread supply pins for good signal integrity

Other assembly options for cost or performance optimization available upon request

Specifications

• Xilinx Spartan-6 LX FPGA
• Cypress CY7C68013A-56LFXC EZ-USB FX2LP™:
• USB microcontroller, high speed USB peripheral controller
• 16-Bit-wide (data-bus) 1 Gigabit (128 Megabyte) DDR3 SDRAM
• 64 Megabit (8 Megabyte) serial Flash memory with dual/quad SPI interface
• 2 x fine-pitch (0.5 mm) 80-pin board-to-board connectors
  Hirose DF17 series
• Up to 40 differential FPGA input/output pins available on B2B connectors
• Up to 109 single-ended FPGA input/output pins available on B2B connectors
• USB and JTAG pins available on B2B connectors
• 3.0 A high-efficiency DC-DC switching regulator for power rail 1.2 V
• 1.0 A high-efficiency DC-DC switching regulator for power rail 1.5 V
• 0.8 A DC-DC linear regulator for power rails 2.5 V and VCCAUX
• 1.5 A high-efficiency DC-DC switching regulator for power rail 3.3 V
• Power supervisory circuits with power-fail
• Power supply voltage range: 4.0 to 5.5 V
• Power supply source: USB port, board-to-board interconnect (e.g. carrier board)
• Dimensions: 47,5 × 40.5 mm (19.2 cm²)
• Minimum height: TBD (without connectors)
• Minimum height on carrier board: TBD
• Weight: 14.0 to 14.5 g
• Temperature grades:
  - commercial (C-type FPGA device)
  - industrial (I-type FPGA device)

Recommended Hardware

• Trenz Electronic TE0303 carrier board
  Trenz Electronic TE0304 demo board
• JTAG programming cable

Heatsink - Spring-Loaded

Made especially for TE0600/TE603 board, spring-loaded, weight: 60g

Part No. 26920

Package Contents

• 1 Thermal Pad
• 4 pressure springs
• 4 screws

Resources

• Revision 01 changes to Revision 02, please read the product change notification here.
• Example projects

Available Models

Pricing, Availability and Ordering

• Concurrent EDA is the US Distributor for Trenz Electronic FPGA Micromodules.
• Please email Ray at This email address is being protected from spambots. You need JavaScript enabled to view it. for pricing and availability.