TE0803 Zynq UltraScale+ Module Datasheet

TE0803 Zynq UltraScale+ Module TE0803 Zynq UltraScale+ Module (bottom)


The Trenz Electronic TE0803 is an industrial-grade MPSoC module integrating a Xilinx Zynq UltraScale+, 2 or 4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

These high-density integrated modules are smaller than a credit card, and available in several variants at the most competitive price.

All parts are at least extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • Xilinx Zynq UltraScale+ ZU2CG, ZU3CG, ZU4CG, ZU2EG, ZU3EG, ZU4EG, ZU4EV, ZU5EV
  • ZU2CG, 784 Pin Packages
  • Dimensions: 5.2 x 7.6 cm
  • Plug-on module with 4 x 160 pin B2B connectors
  • 3 mm mounting holes for skyline heat spreader
  • Rugged for shock and high vibration.
  • 2 or 4 GByte 64-Bit width DDR4 SDRAM
  • 128 MByte QSPI Boot Flash dual parallel
  • User I/O
    • 65 x multi-use I/O's (MIO)
    • 156 high-performance (HP) I/O's (3 banks)
    • Serial transceiver: PS-GTR 4
    • Programmable 4-channel PLL clock generator
  • All power supplies on board, single 3.3V power source required
  • Evenly spread supply pins for good signal integrity.

Other assembly options for cost or performance optimization plus high volume prices available on request.

Available Models

Model Size (cm) FPGA RAM SPI Flash (GPU) (VCU) Temp.
TE0803-03-2AE11-A 5.2 x 7.6 XCZU2CG-1SFVC784E 2 GByte DDR4 128 MByte - - extended inquire for latest
TE0803-03-3AE11-A 5.2 x 7.6 XCZU3CG-1SFVC784E 2 GByte DDR4 128 MByte - - extended inquire for latest
TE0803-03-4AE11-A 5.2 x 7.6 XCZU4CG-1SFVC784E 2 GByte DDR4 128 MByte - - extended inquire for latest
TE0803-03-2BE11-A 5.2 x 7.6 XCZU2EG-1SFVC784E 2 GByte DDR4 64 MByte x - extended inquire for latest
TE0803-03-3BE11-A 5.2 x 7.6 XCZU3EG-1SFVC784E 2 GByte DDR4 128 MByte x - extended in stock
TE0803-03-4BE11-A 5.2 x 7.6 XCZU4EG-1SFVC784E 2 GByte DDR4 128 MByte x - extended inquire for latest
TE0803-03-4DE11-A 5.2 x 7.6 XCZU4EV-1SFVC784E 2 GByte DDR4 128 MByte x x extended inquire for latest
(low profile)
5.2 x 7.6 XCZU4EV-1SFVC784E 4 GByte DDR4 128 MByte x x extended inquire for latest
TE0803-03-5DE11-A 5.2 x 7.6 XCZU5EV-1SFVC784E 2 GByte DDR4 128 MByte x x extended inquire for latest

* These modules are identically constructed to the TE0820-xx-xx-1Ex except there are 2.5 mm Samtec connectors installed instead of 4.0 mm.

Embedded Development Suite

A hardware development platform is available. Latest documentation, design support files, reference design source files and tools are available for download free of charge.

* Device supported by the free Xilinx Vivado WebPACK tool.

Pricing, Availability and Ordering

  • Concurrent EDA is the US Distributor for Trenz Electronic FPGA Micromodules.
  • Currently Available to US customers only.
  • Please email Ray at This email address is being protected from spambots. You need JavaScript enabled to view it. with questions / quotes / orders.