TE0807 Zynq UltraScale+ Module Datasheet

TE0807 Zynq UltraScale+ Module TE0807 Zynq UltraScale+ Module (bottom)


The Trenz Electronic TE0807-02-7DE21-A is a powerful MPSoC module integrating a Xilinx Zynq UltraScale+, 4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, 20 high speed serial transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

All this fits on 5.2 x 7.6 cm board at the most competitive price. These high-density integrated modules are smaller than a credit card, and available in several variants.

All parts are at least extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900E
  • ZU7EV 900 Pin Packages
  • 3 mm mounting holes for skyline heat spreader
  • Size: 52 x 76 mm
  • B2B Connectors: 4 x 160 pin
  • Rugged for shock and high vibration
  • 4 GByte DDR4 SDRAM
  • 128 MByte SPI Boot Flash (dual parallel)
  • User I/Os
    • 65 x PS MIOs, 48 x PL HD GPIOs, 156 x PL HP GIPIOs (3 banks)
    • Serial transceivers: 4 x GTR + 16 x GTH
    • Transceiver clocks inputs and outputs
    • PLL clock generator inputs and outputs
  • Graphic Processing Unit (GPU) + Video codec unit (VCU)
  • Si5345 - 10 output PLL
  • All power supplies on board, single 3.3V Power required
    • 14 on-board DC/DC regulators and 13 LDOs
    • LP, FP, PL separately controlled power domains
  • Support for all boot modes (except NAND)
  • Support for any combination of PS connected peripherals
  • Evenly spread supply pins for good signal integrity

Other assembly options for cost or performance optimization plus high volume prices available on request.

Available Models

Model Size (cm) FPGA RAM SPI Flash (GPU) (VCU) Temp.
TE0807-03-4AI21-A 5.2 x 7.6 XCZU4CG-1FBVB900I 4 GByte DDR4 128 MByte - - industrial March, 2022
TE0807-03-7AI21-A 5.2 x 7.6 XCZU7CG-1FBVB900I 4 GByte DDR4 128 MByte - - industrial March, 2022
TE0807-03-4BE21-A 5.2 x 7.6 XCZU4EG-1FBVB900E 4 GByte DDR4 128 MByte x - extended March, 2022
TE0807-03-7DE21-A 5.2 x 7.6 XCZU7EV-1FBVB900E 4 GByte DDR4 128 MByte x x extended March, 2022
TE0807-03-7DI21-A 5.2 x 7.6 XCZU7EV-1FBVB900I 4 GByte DDR4 128 MByte x x industrial March, 2022

Embedded Development Suite

A hardware development platform is available. Latest documentation, design support files, reference design source files and tools are available for download free of charge.

* Device supported by the free Xilinx Vivado WebPACK tool.

Pricing, Availability and Ordering

  • Concurrent EDA is the US Distributor for Trenz Electronic FPGA Micromodules.
  • Currently Available to US customers only.
  • Please email Ray at This email address is being protected from spambots. You need JavaScript enabled to view it. with questions / quotes / orders.