TE0808 "UltraSoM+" Zynq UltraScale+

Zynq Module TE0808


The Trenz Electronic TE0808 is an industrial-grade MPSoC module integrating a Xilinx Zynq UltraScale+, max. 8 GByte DDR4 SDRAM with 64-Bit width, max. 512 MByte Flash memory for configuration and operation, 20 Gigabit transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

All this in a compact 5,2 x 7,6 cm form factor, at the most competitive price.

Key Features

  • Xilinx Zynq UltraScale+
  • ZU9EG 900 Pin Packages
  • Rugged for shock and high vibration
  • Memory
    - 4x 512 MByte (2 GByte) 64-Bit DDR4
    - 2x 256 MBit (2x 32 MByte) SPI Boot Flash (dual parallel)
  • User I/O 
    - 65 x PS MIOs, 48 x PL HD GPIOs, 156 x PL HP GIPIOs (3 banks)
    - Serial transceiver: GTR 4 + GTH 16
    - GT clocks, I2C 
    - PLL clock inputs and outputs
  • Size: 52 x 76 mm
  • 3 mm mounting holes for skyline heat spreader
  • B2B Connectors: 4 x 160 pin
  • Si5345 - 10 output PLL
  • All power supplies on board, single 3.3V Power required 
    - 14 on-board DC/DC regulators and 13 LDO's 
    - LP, FP, PL separately controlled power domains
  • Support for all boot modes (except NAND) and scenarios
  • Support for any combination of PS connected peripherals
  • Evenly spread supply pins for good signal integrity.

Other assembly options for cost or performance optimization plus high volume prices available on request.


TE0808 Heatsink

Made especially for the TE0808 board. Note that this heatsink requires a gapfiller; as such it is necessary for Trenz to install this part.

Part No.  KK0808-03

TE0808 ZU9 DevKit

Below are images of the kit currently being developed. It includes a ZU9 chip, mini ITX baseboard, power supply, enclosure, and reference design. A block diagram is also shown.

Baseboard Features

  • Mini-ITX form factor
  • ATX Power supply connector (12V only PS Required)
  • optional 12V Standard Power Plug
  • USB3 with USB3 HUB
  • Gigabit Ethernet RJ45
  • MicroSD Card (bootable)
  • eMMC (bootable)
  • PCIe slot - PS GT Connected, one PCIe lane (16 Lane Connector)
  • Displayport Dual Lane PS GT Connected
  • FMC HPC Slot (1.8V max VCCIO)
  • Dual SFP+
  • One Samtec FireFly (4 lanes bidir)
  • Samtec FireFly reverse loopback
  • Fan connectors
  • Intel front panel connector (PWR/RST/LED)
  • Intel HDA Audio connector
  • CAN FD Transceiver (10 Pin IDC Connector)
  • 20 Pin ARM JTAG Connector (PS JTAG0)

PC Enclosure Accessible I/O

  • PCIe
  • FMC
  • Dual SFP+
  • RJ45 Gigabit Ethernet
  • 2x USB3 Host
  • Displayport
  • microSD
  • Two LED's
  • CAN FD (using DB9 to IDC10 Cable)

Core V1 Mini-ITX Housing - technical features

  • Dimensions: 260 x 276 x 316 mm (B x H x T)
  • Material: Steel
  • Colour: Black
  • Drive Slots: 2 x 3,5 Zoll (intern, 3,5 Zoll) and 2 x 2,5 Zoll (intern, 2,5 Zoll)
  • Expansion slots: 2
  • I/O-Panel: 2 x USB 3.0 and 1 x Audio In/Out each
  • Maximum graphic card length: 255 mm (inner enclosure)
  • Maximum graphic card length: 285 mm (outer enclosure)
  • Maximum CPU cooler height: 140 mm
  • Maximum length power supply: 200 mm

Package Contents Starter Kit

  • 1 x Core V1 Mini-ITX Enclosure- black with viewing window and removable sled walls
  • 1 x Power Supply Be quiet! BN142 System Power 7, 400 Watt, 12V, ATX 2.3 with fan
  • 1 x TE0808-04-09EG-1EA with ZU9
  • 1 x TEBF0808-04 base board
  • 1 x Heatsink MBH31001-15W/2.6
  • 1 x TE0790-02 XMOD FTDI JTAG Adapter (compatible with Xilinx-Tools)
  • 1 x TE0790-02L XMOD FTDI JTAG Adapter (independent from Xilinx-Tools)
  • 1 x 8 GB Class 4 microSDHC card
  • 1 x USB cable, Type A to Type B Mini, 2 meter length
  • 2 x Phillips screws, M3 x 6, pan head, zinc coated
  • 2 x Spacer bolts, M3, 10 mm

TE0808 Block Diagram TE0808 DevKit Angle TE0808 DevKit Top TE0808 DevKit w/ Enclosure Enclosure Front-Panel Ports Enclosure Back


Embedded Development Suite

A hardware development platform is available. Latest documentation, design support files, reference design source files and tools are available for download free of charge.

* Device supported by the free Xilinx Vivado WebPACK tool.

Available Models

Model Form factor FPGA RAM (GPU) (VCU) Temperature
TE0808-04-6BE21-A 5.2 x 7.6cm XCZU6EG-1FFVC900E 4 GByte DDR4 x - extended
(0°C to 100°C)
(low profile)
5.2 x 7.6cm XCZU6EG-1FFVC900E 4 GByte DDR4 x - extended
(0°C to 100°C)
TE0808-04-9BE21-A 5.2 x 7.6cm XCZU9EG-1FFVC900E 4 GByte DDR4 x -

(0°C to 100°C)

(low profile)
5.2 x 7.6cm XCZU9EG-1FFVC900E 4 GByte DDR4 x - extended
(0°C to 100°C)
TE0808-04-9GI21-A 5.2 x 7.6cm XCZU9EG-2FFVC900E 4 GByte DDR4 x - industrial
(-40°C to 85°C)
TE0808-04-BBE21-A 5.2 x 7.6cm XCZU15EG-1FFVC900E 4 GByte DDR4 x - extended
(0°C to 100°C)

Pricing, Availability and Ordering

  • Concurrent EDA is the US Distributor for Trenz Electronic FPGA Micromodules.
  • Currently Available to US customers only.
  • Please email Ray at This email address is being protected from spambots. You need JavaScript enabled to view it. with questions / quotes / orders.

Technical Documentation from Trenz Electronic

  • Available upon request.