Zynq UltraScale+ Modules

Zynq MPSoC CG Block DiagramZynq MPSoC CG Block Diagram Zynq MPSoC EG Block DiagramZynq MPSoC EG Block Diagram Zynq MPSoC EV Block DiagramZynq MPSoC EV Block Diagram

 

Zynq® UltraScale+™ MPSoC devices provide 64-bit processor scalability while combining real-time control with soft and hard engines for graphics, video, waveform, and packet processing. Built on a common real-time processor and programmable logic equipped platform, three distinct variants include:

  • CG devices: 2x ARM application processors 
  • EG devices: 4x ARM application processors and a GPU 
  • EV devices: 4x ARM application processors and a real-time H.264/H.265 video codec 

Various form factors and IO configurations are available: 

  • 5.2 x 7.6 cm; 784, 900 pin packages
  • 9 x 9 cm, 900 pin package
  • 4 x 5 cm, 794 pin package
  • 7.5 x 10 cm, 1760 pin package

All parts range from extended temperature range to industrial temperature range.

 

Model Form factor
(cm)

 

 SoC Pin
Packages		 RAM SPI
Flash		 Graphic
Processing
Unit (GPU)		 Video
Codec
Unit (VCU)		 PL
GTH/ GTY		 Temperature
range
TE0803-04-2AE11-A 5.2 x 7.6 XCZU2CG-1SFVC784E 784 2 GB DDR4 128 MB - -   extended
TE0803-04-3AE11-A 5.2 x 7.6 XCZU3CG-1SFVC784E 784 2 GB DDR4 128 MB - -   extended
TE0803-04-4AE11-A 5.2 x 7.6 XCZU4CG-1SFVC784E 784 2 GB DDR4 128 MB - -   extended
TE0803-04-2BE11-A 5.2 x 7.6 XCZU2EG-1SFVC784E 784 2 GB DDR4 128 MB x -   extended
TE0803-04-3BE11-A 5.2 x 7.6 XCZU3EG-1SFVC784E 784 2 GB DDR4 128 MB x -   extended
TE0803-04-4BE11-A 5.2 x 7.6 XCZU4EG-1SFVC784E 784 2 GB DDR4 128 MB x -   extended
TE0803-04-4GE21-L 3) 5.2 x 7.6 XCZU4EG-2SFVC784E 784 4 GB DDR4 128 MB x -   extended
TE0803-04-4GE81-L 3) 5.2 x 7.6 XCZU4EG-2SFVC784E 784 4 GB DDR4 128 MB x -   extended
TE0803-04-4DE11-A 5.2 x 7.6 XCZU4EV-1SFVC784E 784 2 GB DDR4 128 MB x x   extended
TE0803-04-4DE21-L 3) 5.2 x 7.6 XCZU4EV-1SFVC784E 784 4 GB DDR4 128 MB x x   extended
TE0803-04-4DE81-L 3) 5.2 x 7.6 XCZU4EV-1SFVC784E 784 4 GB DDR4 128 MB x x   extended
TE0803-04-5DE11-A 5.2 x 7.6 XCZU5EV-1SFVC784E 784 2 GB DDR4 128 MB x x   extended
TE0803-04-5DI21-A 5.2 x 7.6 XCZU5EV-1SFVC784I 784 4 GB DDR4 128 MB x x   industrial
TE0803-04-5DI81-A 5.2 x 7.6 XCZU5EV-1SFVC784I 784 4 GB DDR4 128 MB x x   industrial
TE0807-03-4AI21-A 5.2 x 7.6 XCZU4CG-1FBVB900I 900 4 GB DDR4 128 MB  - - 16 industrial
TE0807-03-4AI81-A 5.2 x 7.6 XCZU4CG-1FBVB900I 900 4 GB DDR4 128 MB  - - 16 industrial
TE0807-03-7AI21-A 5.2 x 7.6 XCZU7CG-1FBVB900I 900 4 GB DDR4 128 MB - - 16 industrial
TE0807-03-7AI81-A 5.2 x 7.6 XCZU7CG-1FBVB900I 900 4 GB DDR4 128 MB - - 16 industrial
TE0807-03-4BE21-A 5.2 x 7.6 XCZU4EG-1FBVB900E 900 4 GB DDR4 128 MB x - 16 extended
TE0807-03-4BE81-A 5.2 x 7.6 XCZU4EG-1FBVB900E 900 4 GB DDR4 128 MB x - 16 extended
TE0807-03-7DE21-A 5.2 x 7.6 XCZU7EV-1FBVB900E 900 4 GB DDR4 128 MB x x 16 extended
TE0807-03-7DE81-A 5.2 x 7.6 XCZU7EV-1FBVB900E 900 4 GB DDR4 128 MB x x 16 extended
TE0807-03-7DI21-A 5.2 x 7.6 XCZU7EV-1FBVB900I 900 4 GB DDR4 128 MB x x 16 industrial
TE0807-03-7DI81-A 5.2 x 7.6 XCZU7EV-1FBVB900I 900 4 GB DDR4 128 MB x x 16 industrial
TE0808-05-6BE21-A 5.2 x 7.6 XCZU6EG-1FFVC900E 900 4 GB DDR4 128 MB x - 16 extended
TE0808-05-6BE21-L 1) 5.2 x 7.6 XCZU6EG-1FFVC900E 900 4 GB DDR4 128 MB x - 16 extended
TE0808-05-9BE21-A 5.2 x 7.6 XCZU9EG-1FFVC900E 900 4 GB DDR4 128 MB x - 16 extended
TE0808-05-9BE21-L 1) 5.2 x 7.6 XCZU9EG-1FFVC900E 900 4 GB DDR4 128 MB x - 16 extended
TE0808-05-9GI21-A 5.2 x 7.6 XCZU9EG-2FFVC900I 900 4 GB DDR4 128 MB x - 16 industrial
TE0808-05-BBE21-A 5.2 x 7.6 XCZU15EG-1FFVC900E 900 4 GB DDR4 128 MB x - 16 extended
TE0812-02-EM2 9 x 9 XCZU6EG-1FFVC900I 900 4 GB DDR4 ECC 2 x 64 MB - - 12 industrial
TE0812-02-EIVEFM2 9 x 9 XCZU6EG-1FFVC900I 900 4 GB DDR4 ECC 2 x 128 MB - - 12 industrial
TE0813-01-2AE11-A 5.2 x 7.6 XCZU2CG-1SFVC784E 784 2 GB DDR4 128 MB - -   extended
TE0813-01-3AE11-A 5.2 x 7.6 XCZU3CG-1SFVC784E 784 2 GB DDR4 128 MB - -   extended
TE0813-01-4AE11-A 5.2 x 7.6 XCZU4CG-1SFVC784E 784 2 GB DDR4 128 MB - -   extended
TE0813-01-2BE11-A 5.2 x 7.6 XCZU2EG-1SFVC784E 784 2 GB DDR4 128 MB x -   extended
TE0813-01-3BE11-A 5.2 x 7.6 XCZU3EG-1SFVC784E 784 2 GB DDR4 128 MB x -   extended
TE0813-01-4BE11-A 5.2 x 7.6 XCZU4EG-1SFVC784E 784 2 GB DDR4 128 MB x -   extended
TE0813-01-4DE11-A 5.2 x 7.6 XCZU4EV-1SFVC784E 784 2 GB DDR4 128 MB x x   extended
TE0813-01-4DE11-AZ 5.2 x 7.6 XCZU4EV-1SFVC784E 784 2 GB DDR4 128 MB x x   extended
TE0813-01-5DE11-A 5.2 x 7.6 XCZU5EV-1SFVC784E 784 2 GB DDR4 128 MB x x   extended
TE0813-01-5DI21-A 5.2 x 7.6 XCZU5EV-1SFVC784I 784 4 GB DDR4 128 MB x x   industrial
TE0813-01-5DI81-A 5.2 x 7.6 XCZU5EV-1SFVC784I 784 4 GB DDR4 128 MB x x   industrial
TE0817-01-4AI21-A 5.2 x 7.6 XCZU4CG-1FBVB900I 900 4 GB DDR4 128 MB  - - 16 industrial
TE0817-01-7AI21-A 5.2 x 7.6 XCZU7CG-1FBVB900I 900 4 GB DDR4 128 MB - - 16 industrial
TE0817-01-4BE21-A 5.2 x 7.6 XCZU4EG-1FBVB900E 900 4 GB DDR4 128 MB x - 16 extended
TE0817-01-7DE21-A 5.2 x 7.6  XCZU7EV-1FBVB900E 900 4 GB DDR4 128 MB x x 16 extended
TE0817-01-7DI21-A 5.2 x 7.6 XCZU7EV-1FBVB900I 900 4 GB DDR4 128 MB x x 16 industrial
TE0818-01-6BE21-A 5.2 x 7.6 XCZU6EG-1FFVC900E 900 4 GB DDR4 128 MB x - 16 extended
TE0818-01-9BE21-A 5.2 x 7.6 XCZU9EG-1FFVC900E 900 4 GB DDR4 128 MB x - 16 extended
TE0818-01-9GI21-A 5.2 x 7.6 XCZU9EG-2FFVC900I 900 4 GB DDR4 128 MB x - 16 industrial
TE0818-01-BBE21-A 5.2 x 7.6 XCZU15EG-1FFVC900E 900 4 GB DDR4 128 MB x - 16 extended
TE0820-04-2AE21MA 4 x 5 XCZU2CG-1SFVC784E 784 2 GB DDR4 128 MB - - 16 extended
TE0820-04-2AI21MA 4 x 5 XCZU2CG-1SFVC784I 784 2 GB DDR4 128 MB - -   industrial
TE0820-04-3AE21MA 4 x 5 XCZU3CG-1SFVC784E 784 2 GB DDR4 128 MB - -   extended
TE0820-04-4AE21MA 4 x 5 XCZU4CG-1SFVC784E 784 2 GB DDR4 128 MB - -   extended
TE0820-04-2BE21MA 4 x 5 XCZU2EG-1SFVC784E 784 2 GB DDR4 128 MB x -   extended
TE0820-04-2BE21ML 4) 4 x 5 XCZU2EG-1SFVC784E 784 2 GB DDR4 128 MB x -   extended
TE0820-04-2BI21MA 4 x 5 XCZU2EG-1SFVC784I 784 2 GB DDR4 128 MB x -   industrial
TE0820-04-2BI21ML 4) 4 x 5 XCZU2EG-1SFVC784I 784 2 GB DDR4 128 MB x -   industrial
TE0820-04-3BE21MA 4 x 5 XCZU3EG-1SFVC784E 784 2 GB DDR4 128 MB x -   extended
TE0820-04-3BE21ML 4) 4 x 5 XCZU3EG-1SFVC784E 784 2 GB DDR4 128 MB x -   extended
TE0820-04-4DE21MA 4 x 5 XCZU4EV-1SFVC784E 784 2 GB DDR4 128 MB x x   extended
TE0820-04-4DI21MA 4 x 5 XCZU4EV-1SFVC784I 784 2 GB DDR4 128 MB x x   industrial
TE0820-04-5DI21MA 4 x 5 XCZU5EV-1SFVC784I 784 2 GB DDR4 128 MB x x   industrial
TE0821-01-2AE31PA 4 x 5 XCZU2CG-1SFVC784E 784 4 GB DDR4 128 MB - -   extended
TE0821-01-3AE31PA 4 x 5 XCZU3CG-1SFVC784E 784 4 GB DDR4 128 MB - -   extended
TE0821-01-3BE21MA 4 x 5 XCZU3EG-1SFVC784E 784 2 GB DDR4 128 MB x -   extended
TE0821-01-3BE21ML 2) 4 x 5 XCZU3EG-1SFVC784E 784 2 GB DDR4 128 MB x -   extended
TE0821-01-3BI21MA 4 x 5 XCZU3EG-1SFVC784I 784 2 GB DDR4 128 MB x -   industrial
TE0821-01-4DE31ML 4 x 5 XCZU4EV-1SFVC784E 784 4 GB DDR4 128 MB x x   extended
TE0823-01-3PIU1MA 4 x 5 XCZU3CG-L1SFVC784 784 1 GB LPDDR4 128 MB - -   industrial
TE0823-01-3PIU1ML 5) 4 x 5 XCZU3CG-L1SFVC784 784 1 GB LPDDR4 128 MB - -   industrial
TE0865-02-ABI21MA 7.5 x 10 XCZU11EG-1FFVC1760I C1760 8 GB DDR4 256 MB x - 48 extended
TE0865-02-DGE23MA 7.5 x 10 XCZU17EG-2FFVC1760E C1760 8 GB DDR4 256 MB x - 48 extended
TE0865-02-FBE23MA 7.5 x 10 XCZU19EG-1FFVC1760E C1760 8 GB DDR4 256 MB x - 48 extended

1) Identical to according variant of ZU3-, ZU06- and ZU09 series, except the 1 mm Samtec connectors.
2) Identical to variant TE0821-xx-3BE21MA except the 2.5 mm Samtec connectors.
3) Identical to variant TE0803-xx-4DE11-A/TE0803-xx-4BE11-A except the 1 mm Samtec connectors and 4 GByte DDR4.
4) Identical to variant TE0820-xx-2BE21MA/TE0820-xx-2BI21MA/TE0820-xx-3BE21MA except the 2.5 mm Samtec connectors.
5) Identical to variant TE0823-xx-3PIU1MA except the 2.5 mm Samtec connectors.

 

Key Features of TE0803

  • Xilinx Zynq UltraScale+ 
  • Dimensions: 5.2 x 7.6 cm
  • Plug-on module with 4 x 160 pin B2B connectors
  • Rugged for shock and high vibration
  • 3 mm mounting holes for skyline heat spreader
  • 2 GByte (64-bit) DDR4 SDRAM
  • 128 MByte QSPI Boot Flash dual parallel
  • 2 Kbit Serial EEPROM for MAC Address
  • 48 High-density (HD) I/O's (2 banks)
  • User I/O
    • 65 x multi-use I/O's (MIO)
    • 156 high-performance (HP) I/O's (3 banks)
    • Serial transceiver: PS GTR 4
    • Programmable 4-channel PLL clock generator
  • All power supplies on board, single 3.3V power source required
  • Evenly spread supply pins for good signal integrity

Key Features of TE0807

  • Xilinx Zynq UltraScale+ 
  • 3 mm mounting holes for skyline heat spreader
  • Size: 5.2 x 7.6 cm
  • B2B Connectors: 4 x 160 pin
  • Rugged for shock and high vibration
  • 4 GByte DDR4 SDRAM
  • 128 MByte SPI Boot Flash (dual parallel)
  • User I/Os
    • 65 x PS MIOs, 48 x PL HD GPIOs, 156 x PL HP GIPIOs (3 banks)
    • Serial transceivers: 4 x GTR + 16 x GTH
    • Transceiver clocks inputs and outputs
    • PLL clock generator inputs and outputs
  • Si5345 - 10 output PLL
  • All power supplies on board, single 3.3V Power required
    • 14 on-board DC/DC regulators and 13 LDOs
    • LP, FP, PL separately controlled power domains
  • Support for all boot modes (except NAND)
  • Support for any combination of PS connected peripherals
  • Evenly spread supply pins for good signal integrity

Key Features of TE0808

  • Xilinx Zynq UltraScale+ 
  • 3 mm mounting holes for skyline heat spreader
  • Size: 52 x 76 mm
  • B2B Connectors: 4 x 160 pin
  • Rugged for shock and high vibration
  • 4 GByte 64-Bit DDR4 SDRAM
  • 128 MByte SPI Boot Flash (dual parallel)
  • User I/Os
    • 65 x PS MIOs, 48 x PL HD GPIOs, 156 x PL HP GIPIOs (3 banks)
    • Serial transceivers: 4 x GTR + 16 x GTH
    • Transceiver clocks inputs and outputs
    • PLL clock generator inputs and outputs
  • All power supplies on board, single 3.3 V Power required
    • 14 on-board DC/DC regulators and 13 LDOs
    • LP, FP, PL separately controlled power domains
  • Support for all boot modes (except NAND) and scenarios
  • Support for any combination of PS connected peripherals
  • Evenly spread supply pins for good signal integrity

Key Features of TE0812

  • SoC/FPGA
    • Package: FFVC900
    • Device: ZU6
    • Engine: EG
    • Speedgrade: -1
    • Temperature range: Industrial
  • RAM/Storage
    • 4 GByte DDR4 SDRAM with ECC
    • 2 x 32 GByte e.MMC
    • 2 x 64 MByte serial Flash
    • 2 x 4 Mbit MRAM
  • On Board
    • Vorago VA41630-PQ176F0EBA
    • 2 x B2B APM6-100-06.5-L-04-2
    • LSHM-130-01-F-DH-A-S-K-TR Debug connector
  • Interface to FPGA
    • via B2B Connector
      • 12 x GTH
      • 4 x GTR
      • 104 x HP PL I/Os (+1.8V)
      • 17 x HP PL AD I/Os (+1.8V)
      • 6 x HD PL I/Os (+3.3V)
      • MIOs for 2 x CAN
      • MIOs for ETH
    • via debug Connector
      • 2 x HD PL I/Os (+3.3V)
      • MIOs for ETH
      • MIOs for UART
  • Interface to Vorago
    • via B2B Connector
      • SpaceWire
      • Ethernet
      • 4 x GPIO
      • 2 x Analog-Output
      • PPSIn/PPSOut
      • UART
      • 2 x CAN
      • I2C
    • via debug Connector
      • Reset
      • UART
      • JTAG
  • Power
    • 12V power supply needed via B2B connector
  • Dimension
    • 90 mm x 90 mm

Block diagram generation is in progress...

Key Features of TE0813

  • Xilinx Zynq UltraScale+ 
  • Dimensions: 5.2 x 7.6 cm
  • Plug-on module with 4 x 240 pin B2B connectors
  • Rugged for shock and high vibration
  • 3 mm mounting holes for skyline heat spreader
  • 2 GByte (64-bit width) DDR4 SDRAM
  • 128 MByte QSPI Boot Flash (dual parallel)
  • 2 Kbit serial EEPROM with EUI-48 Node Identity
  • User I/O
    • 65 x multi-use I/O's (MIO)
    • 48 x high-density (HD) I/O's
    • 156 high-performance (HP) I/O's
    • Serial transceiver: 4 x GTR 4
    • Programmable 4-channel PLL clock generator
  • All power supplies on board
  • Single 3.3V power source or 5V and 3.3V standby power sources required
  • Evenly spread supply pins for good signal integrity

Block diagram generation is in progress...

Key Features of TE0817

  • Xilinx Zynq UltraScale+ 
  • 3 mm mounting holes for skyline heat spreader
  • Size: 5.2 x 7.6 cm
  • Plug-on module with 4 x 240 pin B2B connectors
  • Rugged for shock and high vibration
  • 4 GByte DDR4 SDRAM
  • 128 MByte QSPI Boot Flash (dual parallel)
  • User I/Os
    • 65 x PS MIOs
    • 48 x PL HD GPIOs
    • 156 x PL HP GIPIOs (3 banks)
    • Serial transceivers: 4 x GTR + 16 x GTH
    • Transceiver clocks inputs and outputs
    • PLL clock generator inputs and outputs
  • Si5345 - 10 output PLL
  • All power supplies on board, single 3.3V Power required
    • 14 on-board DC/DC regulators and 13 LDOs
    • LP, FP, PL separately controlled power domains
  • Support for all boot modes (except NAND)
  • Support for any combination of PS connected peripherals
  • Evenly spread supply pins for good signal integrity

Block diagram generation is in progress...

Key Features of TE0818

  • Xilinx Zynq UltraScale+  with Graphic Processing Unit (GPU)
  • 3 mm mounting holes for skyline heat spreader
  • Size: 52 x 76 mm
  • Plug-on module with 4 x 240 pin B2B connectors
  • Rugged for shock and high vibration
  • 4 GByte (64-Bit) DDR4 SDRAM
  • 128 MByte SPI Boot Flash (dual parallel)
  • User I/Os
    • 65 x PS MIOs
    • 48 x PL HD GPIOs
    • 156 x PL HP GIPIOs (3 banks)
    • Serial transceivers: 4 x GTR + 16 x GTH
    • Transceiver clocks inputs and outputs
    • PLL clock generator inputs and outputs
  • All power supplies on board, single 3.3 V Power required
    • 14 on-board DC/DC regulators and 13 LDOs
    • LP, FP, PL separately controlled power domains
  • Support for all boot modes (except NAND) and scenarios
  • Support for any combination of PS connected peripherals
  • Evenly spread supply pins for good signal integrity

Block diagram generation is in progress...

Key Features of TE0820

  • Xilinx Zynq UltraScale+ 
    • Application Processor: Dual-core ARM Cortex-A53 MPCore
    • Real-Time Processor: Dual-core ARM Cortex-R5 MPCore
    • Four high-speed serial I/O (HSSIO) interfaces supporting following protocols:
      • PCI Express interface version 2.1 compliant
      • SATA 3.1 specification compliant interface

      • DisplayPort source-only interface with video resolution up to 4k x 2k

      • USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
      • 1 GB/s serial GMII interface
    • 132 x HP PL I/Os (3 banks)
    • 14 x PS MIOs (6 of the MIOs intended for SD card interface in default configuration)
    • 4 x serial PS GTR transceivers
  • Rugged for shock and high vibration
  • Plug-on module with 2 x 100-pin and 1 x 60-pin Razor Beam High-Speed hermaphroditic Terminal/Socket Strips (regular 4 mm)
  • 2 GByte DDR4 SDRAM, 32-Bit databus-width
  • 128 MByte QSPI boot Flash in dual parallel mode
  • 8 GByte e.MMC Memory (up to 64 GByte)
  • Programmable quad PLL clock generator PLL for PS GTR clocks (optional external reference)
  • Gigabit Ethernet transceiver PHY
  • MAC address serial EEPROM with EUI-48 node identity
  • Hi-speed USB2 ULPI transceiver with full OTG support
  • All power supplies on board
  • Evenly spread supply pins for good signal integrity
  • 4 x 5 cm form factor

Key Features of TE0821

  • Xilinx Zynq UltraScale+ 
    • Application Processor: Dual-Core ARM Cortex-A53 MPCore
    • Real-Time Processor: Dual-core ARM Cortex-R5 MPCore
    • Four high-speed serial I/O (HSSIO) interfaces supporting following protocols:
      • PCI Express interface version 2.1 compliant
      • SATA 3.1 specification compliant interface

      • DisplayPort source-only interface with video resolution up to 4k x 2k

      • USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
      • 1 GB/s serial GMII interface
    • 34 x High Performance und 96 x High Density PL I/Os
    • 14 x PS MIOs (6 of the MIOs intended for SD card interface in default configuration)
    • 4 x serial PS GTR transceivers
  • Rugged for shock and high vibration
  • Plug-on module with 2 x 100-pin and 1 x 60-pin Razor Beam High-Speed hermaphroditic Terminal/Socket Strips (regular 4 mm)
  • 4 GByte DDR4 SDRAM, 32-Bit databus-width
  • 128 MByte QSPI boot Flash in dual parallel mode
  • 64 GByte e.MMC Memory
  • Programmable quad PLL clock generator PLL for PS GTR clocks (optional external reference)
  • Gigabit Ethernet transceiver PHY
  • MAC address serial EEPROM with EUI-48 node identity
  • Hi-speed USB2 ULPI transceiver with full OTG support
  • All power supplies on board
  • Evenly spread supply pins for good signal integrity
  • size: 4 x 5 cm

Key Features of TE0823

General

  • Rugged for shock and high vibration
  • Evenly spread supply pins for good signal integrity
  • Plug-on module with 2 x 100 pin and 1 x 60 pin Razor Beam High-Speed hermaphroditic headers for high speeds (regular 4 mm)

SoC/FPGA

  • Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I (Low Power)
    • Application Processor: Dual-core ARM Cortex-A53 MPCore
    • Real-Time Processor: Dual-core ARM Cortex-R5 MPCore
  • Package: SFVC784
  • Device: ZU3
  • Engine: CG
  • Speed: -1LI (also non-low power assembly options possible)
  • Temperature range: industrial

RAM/Storage

  • Low power DDR4 on PS with 32 bit data width
  • 128 MByte QSPI boot Flash in dual parallel mode
  • 8 GByte e.MMC memory with 8 bit data width
  • MAC address serial EEPROM with EUI-48 node identity

On Board

  • Lattice LCMXO2
  • Programmable Quad-PLL clock generator PLL for PS-GTR clock generator (optional external reference)
  • Gigabit Ethernet transceiver PHY
  • Hi-speed USB2 ULPI transceiver with full OTG support

Interfaces

  • 132 x HP PL I/Os (3 banks)
  • ETH
  • USB
  • 4 GTR (for USB3, SATA, PCIe, DP)
    Four high-speed serial I/O (HSSIO) interfaces supporting following protocols:
    • PCI Express interface version 2.1 compatible
    • SATA 3.1 specification compliant interface

    • DisplayPort source-only interface with video resolution up to 4k x 2k

    • USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
    • 1 GB/s serial GMII interface
  • 14 x PS MIOs
    • MIO for UART
    • thereof 6 MIO for SD card interface (standard configuration)
    • MIO for PJTAG
  • JTAG
  • Ctrl

Power

  • 3.3V-5V main input
  • 3.3V controller input
  • Variable bank I/O power input
  • All power supplies on board

Dimension

  • 4 x 5 cm form factor

Key Features of TE0865

  • Xilinx Zynq UltraScale+ 
  • Rugged for shock and high vibration
  • Graphics Processing Unit (GPU): Mali-400 MP2
  • Plug-on module with 4 x Samtec ADM6 board to board connectors
  • 4 GByte (64-bit) DDR4 SDRAM with ECC on PS
  • 4 GByte (64-bit) DDR4 SDRAM on PL
  • 256 MByte QSPI boot Flash
  • 8 GByte e.MMC
  • 1 x Gigabit Ethernet transceiver PHY
  • USB2.0 PHY
  • Total I/O: 370
  • Gigabit transceivers: 32 x GTH, 16 x GTY, 4 x GTR
  • EEPROM with MAC
  • System controller (Intel MAX 10)
  • All power supplies on board, 12V single supply
  • Evenly spread supply pins for good signal integrity
  • Dimensions: 7.5 x 10 cm form factor

Block diagram generation is in progress...

 

 

Pricing, Availability and Ordering

  • Concurrent EDA is the US Distributor for Trenz Electronic GmbH.
  • Currently available to North American customers only.
  • Please email us at This email address is being protected from spambots. You need JavaScript enabled to view it. with questions / quotes / orders.

Technical Documentation from Trenz Electronic

  • Available upon request.